Sunline and Huawei has collaborated to launch the Digital Loan One Box Solution, a global contactless solution for financial services.
The Digital Loan One Box Solution is built on Huawei FusionCube Hyper-Converged Infrastructure adopting the enterprise-level microservices banking framework EDSP released by Sunline in 2020.
The solution supports rapid, dynamic horizontal scaling on both the business and system demands. It also provides DevOps continuous delivery assembly line to meet the increasingly agile development requirements of financial institutions.
This will be rolled out across Southeast Asia, the Middle East, Latin America, and Africa, where financial inclusiveness is urgently necessary.
It allows financial institutions to launch a wide range of contactless services, such as online loan product campaign, customer E-KYC, risk assessment, fund disbursement, and post-loan processing. The solution responds to the urgent need from both FIs and their customers for digital financial services.
“Amid the ongoing pandemic, the solution comes at the right time for financial institutions. It can satisfy the demands of efficient lending and loaning for both financial institutions and customers during such special times. Within this industry, we will continue to develop a global ecosystem and scenario-based solutions from 2C to 2B with global partners,” said Jason Cao, President of Global Financial Services Business Unit, Enterprise Business Group at Huawei. “Together with customers and partners in the industry, we will start with 5G and seize the opportunities across five major tech domains — connectivity, cloud, computing, AI, and industry applications. Ultimately, we will provide scenario-based smart solutions and technologies to facilitate the digital transformation for financial customers.”
Hongan Li, Senior Vice President of Sunline, added, “Sunline is a global banking IT service company. We keep innovating to lead in FinTech and enrich the interconnection of life. During COVID-19, we realized the urgent need for technological innovation, digital services, and open financial services global wide. In light of this, Sunline and Huawei are now launching the Digital Loan One Box Solution. The solution is designed for financial institutions and customers, especially for those lacking technology capabilities. It is based on Sunline’s enterprise-level microservices framework for banks. The agile platform features high flexibility, loose coupling, high performance, and distributed deployment. It meets the dynamic horizontal scaling requirements of financial institutions of any size at both the business and system demands. Our aim is to provide a solution that is practical and helpful in this extraordinary time.”
